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DEADLINE: Enhanced LRAP Fellowship Applications Due 3pm Today

Start/End All Day; Friday June 20, 2014 EDT

Columbia is proud to offer one of the most supportive Loan Repayment Assistance Programs (LRAPs) of any law school. The Lowenstein Fellowship and the Berger Fellowship provide enhanced loan repayment support to Columbia Law School students who show exceptional dedication and potential for contribution to public interest law, including government service. Specific information about each of the Fellowships, including selection criteria and benefits and application materials, is provided on SJI's LRAP webpage. This is a brief overview.  

Lowenstein Fellowships
Endowed by Professor Louis Lowenstein and his wife Helen, these fellowships are awarded to Columbia Law School graduates who show exceptional dedication and potential for contribution to public interest law, including government service.

Berger Fellowships
Endowed by Max W. Berger ’71 and Dale Berger, these fellowships are awarded to Columbia Law School graduates whose careers and first postgraduate jobs (other than a judicial clerkship) will be substantially devoted to using the law to fight racial, gender, and/or other discrimination. This fellowship is offered in alternating years with the Bernstein Fellowship.

You may apply to either or both fellowships. All applications must be on the relevant Application Form (see the above link) and must be complete. If you are applying for more than one Fellowship, you must attach the requested materials (essays, resume, transcript and reference letters) to each Form. Incomplete applications will not be considered.

Do not apply if you will be a judicial law clerk next year.  You will have a chance to apply at the end of your clerkship.

Application Forms must be received by Social Justice Initiatives no later than Friday, June 20, 2014 at 3:00 p.m.  Applications may not be submitted by fax or e-mail.

Questions should be directed to Brian Juergens of Social Justice Initiatives at brian.juergens@law.columbia.edu.